MODL Engineering develops high-performance liquid cooling infrastructure and supporting components tailored for the evolving demands of hyperscale, co-location, and enterprise facilities.
We design and manufacture precision-engineered systems — including our modular GOOP LOOP™ platform — that support the deployment of immersion, cold plate (direct-to-chip), and rear door heat exchanger (RDHx) technologies.
Every solution is delivered with a focus on modular scalability, minimal downtime, and compliance with vendor specifications such as NVIDIA DGX and OCP data centre standards.
Liquid Cooled Infrastructure Product Development and Engineering
MODL Engineering has been involved with innovations in the liquid cooling infrastructure space, with multiple active product developments all aiming to improve speed of deployment, performance, reliability and sustainability
The Goop Loop™
Modular Liquid Distribution for High-Density Compute
The GOOP LOOP™ is MODL Engineering’s precision-engineered liquid distribution platform, developed to address the demands of high-density, liquid-cooled compute environments. As liquid cooling becomes essential to support the performance and thermal management requirements of AI-driven workloads, GOOP LOOP™ enables data centers to deploy scalable secondary liquid loops — without overhauling core infrastructure.
Designed to interface directly with the secondary side of CDUs or facility chilled water systems, the GOOP LOOP™ routes coolant to rack-mounted liquid-cooled systems, supporting a range of thermal topologies including direct-to-chip (DTC), immersion, and rear door heat exchangers.
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