Goop Loop

The GOOP LOOP™ is MODL Engineering’s precision-engineered liquid distribution platform, developed to address the demands of high-density, liquid-cooled compute environments.

Designed to interface directly with the secondary side of CDUs or facility chilled water systems, the GOOP LOOP™ routes coolant to rack-mounted liquid-cooled systems, supporting a range of thermal topologies including direct-to-chip (DTC), immersion, and rear door heat exchangers.

As liquid cooling becomes essential to support the performance and thermal management requirements of AI-driven workloads, GOOP LOOP™ enables data centers to deploy scalable secondary liquid loops — without overhauling core infrastructure.

Built for Performance, Engineered for Scale

GOOP LOOP™ is a modular piping platform engineered to support:

Direct-to-chip (cold plate) cooling Immersion cooling systems Rear door heat exchangers (RDHx) and in-row cooling
GOOP LOOP™ is a modular piping platform engineered to support:
GOOP LOOP™ is a modular piping platform engineered to support:

It is available off-the-shelf in standard capacities and integrates directly with either facility chilled water or the secondary side of a CDU (Chilled Water Distribution Unit).

Features

Modular Design

Configurable loop layouts for overhead or underfloor installation

Flexible Valve Orientation

Adapted to site-specific service and access needs

Non-Disruptive Servicing

Individual sections can be isolated and drained for maintenance without affecting other connected racks

Manufactured to Strict QA Standards

Built in controlled environments, fully purged welds, passivation, flushing, and pressure testing to ensure cleanliness, corrosion resistance, and long-term system integrity

Take-off configurations are tailored per loop based on rack layout and thermal load.

System Capacities

Available in standard circulating capacities of:

500 kW
1000 kW
1500 kW
2000 kW

Take-off configurations are tailored per loop based on rack layout and thermal load.

Configurable System Options

Rack Take-Off Spacing

Match server rack pitch (OCP standard or custom layouts)

Loop Routing & Geometry

Define aisle pitch, elevation changes, and overhead/underfloor configuration

Connection Types

Select from quick-connects, flanged, or threaded couplings based on CDU and rack hardware

Isolation Valve Layout

Determine valve placement for servicing strategy and maintenance zones

Jointing Methods

Choose between TIG-welded, mechanical, or hybrid solutions depending on installation constraints

Fluid Compatibility

Configure for mains water, deionised water, or glycol/water mix

Insulation Specification

Add internal or external insulation to address condensation or heat gain/loss

Deployment & Documentation

Each system is supplied with:

Project-specific installation drawings
Pre-labeled and modular loop segments
Pressure-tested, passivated assemblies ready for installation welding, or downtime

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